Influence of thermo-mechanical stress on the microstructure of sintered silver joints for microelectronics

Silver sintering is a promising emerging microelectronic assembly technology. In this paper sintered silver attachment joints of silicon dies have been studied. It has been pointed out that in pressureless process conditions porosity can disappear of some zones of silver sintered attachment joints. The link between densified zones and the thermo-mechanical stress has been demonstrated. Densified zones of silver sintered joints could play a great role in reliability improvement.