• DocumentCode
    3712614
  • Title

    Improvement of power integrity with Die-Attached STO thin film capacitors

  • Author

    Masamitsu Yoshizawa;Seisei Oyamada;Atsunori Hattori;Toru Nakura;Masahiro Kano;Kunihiro Asada

  • Author_Institution
    Noda Screen Co., Ltd., Komaki, Aichi, Japan
  • fYear
    2015
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    This paper demonstrates that our Die-Attached STO thin film decoupling capacitor is effective for reduction of the resonant power supply noise of LSIs. Shmoo plots shows improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our STO thin film capacitors.
  • Keywords
    "Capacitors","Large scale integration","Power supplies","System-on-chip","Capacitance","Electrodes","Resonant frequency"
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2015 IEEE
  • Print_ISBN
    978-1-4799-8814-3
  • Type

    conf

  • DOI
    10.1109/ICSJ.2015.7357392
  • Filename
    7357392
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3712614