Title :
Improvement of power integrity with Die-Attached STO thin film capacitors
Author :
Masamitsu Yoshizawa;Seisei Oyamada;Atsunori Hattori;Toru Nakura;Masahiro Kano;Kunihiro Asada
Author_Institution :
Noda Screen Co., Ltd., Komaki, Aichi, Japan
Abstract :
This paper demonstrates that our Die-Attached STO thin film decoupling capacitor is effective for reduction of the resonant power supply noise of LSIs. Shmoo plots shows improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our STO thin film capacitors.
Keywords :
"Capacitors","Large scale integration","Power supplies","System-on-chip","Capacitance","Electrodes","Resonant frequency"
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2015 IEEE
Print_ISBN :
978-1-4799-8814-3
DOI :
10.1109/ICSJ.2015.7357392
