Chip-scale packaging of hybrid-integrated Si photonic transceiver: Optical I/O core

A chip-scale package structure for Si photonic optical transceivers has been developed. The foot print of the transceiver is 5 mm × 5mm. By using an optical pin array and glass interposer with through-glass vias (TGVs), high density optical and electrical I/O interfaces are configured on one side of the package. The optical pin acts as a vertical waveguide or spot-size converter (SSC). The combination of the optical pin and the O-band multimode transmission provides large misalignment tolerance for the optical interface. The developed optical transceiver has a high degree of usability for various applications, such as multi-chip modules and active optical cables, and is called “optical I/O core.” The optical I/O core demonstrated 25 Gbps/ch error-free operation over a 300-m multimode fiber. The optical I/O core is a promising solution for relieving the I/O bottleneck in high-bandwidth inter-chip data transmission.