Title :
EMC performance analysis of a processor/memory system using PCB and Package-On-Package
Author :
Etienne Sicard;Alexandre Boyer;Priscila Fernandez-Lopez;An Zhou;Nicolas Marier;Fr?d?ric Lafon
Author_Institution :
INSA, University of Toulouse, 135 av. de Rangueil, 31077, France
Abstract :
In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation (NG) 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.
Keywords :
"Electromagnetic compatibility","Integrated circuit modeling","Bonding","Pins","Analytical models","Magnetic field measurement"
Conference_Titel :
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop on the
DOI :
10.1109/EMCCompo.2015.7358364
