DocumentCode
3715077
Title
Comparative analysis of thermal and optical properties for the LEDs with different circuit boards
Author
Jiajia Fu;Haizhong Xie;Haicheng Cao;Lixia Zhao;Xuejiao Sun;Baojun Sun;Junxi Wang;Jinmin Li
Author_Institution
Institute of Semiconductors, Chinese Academy of Sciences, No.A35, Qinghua East Road, Haidian District, Beijing P R China
fYear
2015
Firstpage
85
Lastpage
87
Abstract
We have fabricated three types of high power LEDs with different circuit boards: Al2O3 ceramic board, epoxy PCB with Cu-deposited on the wall of holes and epoxy PCB with Cu-filled through holes. The different contribution of the package have been separated and investigated by using the derivative of temperature rise in the time domain and thermal transient method. The results show that although the thermal conductivity coefficient of epoxy PCB is much smaller than that of ceramic, PCB integrated with Cu can improve the heat-dissipation significantly and decrease the thermal resistance. In addition, this design can also improve the EQE droop effect.
Keywords
"Light emitting diodes","Printed circuits","Ceramics","Thermal conductivity","Thermal resistance","Conductivity","Heating"
Publisher
ieee
Conference_Titel
Solid State Lighting (SSLCHINA), 2015 12th China International Forum on
Print_ISBN
978-1-5090-0175-0
Type
conf
DOI
10.1109/SSLCHINA.2015.7360695
Filename
7360695
Link To Document