Fracture analysis of an edge-cracked dielectric plate via novel boundary integral equation method

Dielectric materials are widely used as insulating materials in electronic devices. However, cracks inside dielectric materials may cause performance degradation of the electronic devices. In this paper, the sub-region boundary element method is developed for handling the edge crack problem, in which the area in the crack cavity is treated separately. The proposed method is distinguished from any existing boundary element formulation for fracture analysis. An exact boundary condition is applied to crack faces. The whole calculation is done by using the software Mathematica. Finally, we obtain numerical results of the electric field within the crack cavity and calculate the stress and the electric displacement intensity factors.