DocumentCode
3718291
Title
Low temperature direct bonding of polyether ether ketone (PEEK) and Pt
Author
Weixin Fu;Akitsu Shigetou;Shuichi Shoji;Jun Mizuno
Author_Institution
Waseda University/ National Institute for Material Science, 3-4-1, Okubo, Shinjuku, Tokyo, Japan, 169-8555
fYear
2015
Firstpage
217
Lastpage
220
Abstract
The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.
Keywords
"Bonding","Radiation effects","Substrates","Surface contamination","Surface morphology","Surface treatment","Heating"
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN
978-1-4673-9690-5
Type
conf
DOI
10.1109/IMPACT.2015.7365179
Filename
7365179
Link To Document