Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at 150 °C via the surface modification using vacuum ultraviolet (VUV). This technology will be of practical use in the eco-friendly fabrication of light-weight and bio-inert electronic system, such as a body-implantation medical device. The VUV irradiation helped creating the bridging layers, which consisted of hydroxyl groups due to the residual water molecules inside the bonding chamber, both on PEEK and Pt surfaces. Upon heating at 150 °C, the Pt ions diffused into PEEK side as the micro-grains at the PEEK-Pt interface, and a voidless interface was successfully obtained with the calculated bonding strain release energy of around 4.2 N/m. This energy is higher than the surface energy of both PEEK and Pt.