• DocumentCode
    3718293
  • Title

    Effect of fiber cloths structure on thermal fatigue strength of through hole in printed circuit boards

  • Author

    Takahiro Kinoshita;Takashi Kawakami;Shogo Iwade;Hideki Mizushina;Hiroshi Iinaga

  • Author_Institution
    Toyama Prefectural University / 5180 Kurokawa, Imizu, 939-0398, Japan
  • fYear
    2015
  • Firstpage
    58
  • Lastpage
    60
  • Abstract
    In this study, notch-shaped irregularities which could be observed at actual through hole were modeled. Inelastic thermal stress simulation was performed to discuss effect of fiber cloths structures on thermal fatigue strength around through hole in PCB by using a large scale simulator ADVENTURECluster (ver. 4. 8) [12], which was based on finite element method (FEM).
  • Keywords
    "Strain","Copper","Stress","Thermal stresses","Finite element analysis","Fatigue","Resins"
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
  • Print_ISBN
    978-1-4673-9690-5
  • Type

    conf

  • DOI
    10.1109/IMPACT.2015.7365181
  • Filename
    7365181
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3718293