Title :
Effect of fiber cloths structure on thermal fatigue strength of through hole in printed circuit boards
Author :
Takahiro Kinoshita;Takashi Kawakami;Shogo Iwade;Hideki Mizushina;Hiroshi Iinaga
Author_Institution :
Toyama Prefectural University / 5180 Kurokawa, Imizu, 939-0398, Japan
Abstract :
In this study, notch-shaped irregularities which could be observed at actual through hole were modeled. Inelastic thermal stress simulation was performed to discuss effect of fiber cloths structures on thermal fatigue strength around through hole in PCB by using a large scale simulator ADVENTURECluster (ver. 4. 8) [12], which was based on finite element method (FEM).
Keywords :
"Strain","Copper","Stress","Thermal stresses","Finite element analysis","Fatigue","Resins"
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
DOI :
10.1109/IMPACT.2015.7365181
