• DocumentCode
    3718294
  • Title

    The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide

  • Author

    Takashi Tasaki;Atsushi Shiotani;Masayuki Tsuji;Taiyou Nakamura;Takashi Yamaguchi

  • Author_Institution
    HB Group R & D Dept. II Electronic Materials Division ARAKAWA CHEMICAL INDUSTRIES, LTD., 1-1-9, Tsurumi Tsurumi-Ku, Osaka, 538-0053, Japan
  • fYear
    2015
  • Firstpage
    221
  • Lastpage
    224
  • Abstract
    The advance of wireless communications and broadband technologies is dramatically progressing with the remarkable growth of the market of information technology equipments such as mobile phones and tablets. In order to meet ever-enlargement of transmitting data, transmission frequency in circuits tends to become high and the integrity of a high-frequency signal can be damaged by transmission loss.
  • Keywords
    "Polyimides","Copper","Solvents","Dielectrics","Films","Substrates"
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
  • Print_ISBN
    978-1-4673-9690-5
  • Type

    conf

  • DOI
    10.1109/IMPACT.2015.7365182
  • Filename
    7365182
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3718294