Title :
The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide
Author :
Takashi Tasaki;Atsushi Shiotani;Masayuki Tsuji;Taiyou Nakamura;Takashi Yamaguchi
Author_Institution :
HB Group R & D Dept. II Electronic Materials Division ARAKAWA CHEMICAL INDUSTRIES, LTD., 1-1-9, Tsurumi Tsurumi-Ku, Osaka, 538-0053, Japan
Abstract :
The advance of wireless communications and broadband technologies is dramatically progressing with the remarkable growth of the market of information technology equipments such as mobile phones and tablets. In order to meet ever-enlargement of transmitting data, transmission frequency in circuits tends to become high and the integrity of a high-frequency signal can be damaged by transmission loss.
Keywords :
"Polyimides","Copper","Solvents","Dielectrics","Films","Substrates"
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
DOI :
10.1109/IMPACT.2015.7365182
