The world in 2025 - predictions for the next ten years

The one constant in electronics manufacturing is change. Moore´s Law which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (IC´s) at lower cost for decades has started to slow down. Rising costs for chip design from one node to the next are expected due to increased process complexity and number of lithography steps. This presents opportunities for advanced 2.5D System in Package (SiP) integration where multiple chips of different functionalities can be integrated on an interposer. Increasing demand for miniaturization in high performance electronic devices and strong penetration into the major market of the hand held consumer electronics sector will drive the SiP market. Faster time-to-market, lower development costs, smaller form factors and heterogeneous integration are very attractive to the major packaging companies too.