DocumentCode :
3718338
Title :
Microscopic deformation of polycrystalline pure copper wire during tension
Author :
Naoya Tada;Yoshitaka Matsukawa;Takeshi Uemori;Toshiya Nakata
Author_Institution :
Graduate School of Natural Science and Technology, Okayama University, 3-1-1 Tsushimanaka, Kita-ku, 700-8530, Japan
fYear :
2015
Firstpage :
229
Lastpage :
232
Abstract :
In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
Keywords :
"Wires","Microscopy","Copper","Strain","Fatigue","Loading","Grain boundaries"
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
Type :
conf
DOI :
10.1109/IMPACT.2015.7365226
Filename :
7365226
Link To Document :
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