• DocumentCode
    3718338
  • Title

    Microscopic deformation of polycrystalline pure copper wire during tension

  • Author

    Naoya Tada;Yoshitaka Matsukawa;Takeshi Uemori;Toshiya Nakata

  • Author_Institution
    Graduate School of Natural Science and Technology, Okayama University, 3-1-1 Tsushimanaka, Kita-ku, 700-8530, Japan
  • fYear
    2015
  • Firstpage
    229
  • Lastpage
    232
  • Abstract
    In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
  • Keywords
    "Wires","Microscopy","Copper","Strain","Fatigue","Loading","Grain boundaries"
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
  • Print_ISBN
    978-1-4673-9690-5
  • Type

    conf

  • DOI
    10.1109/IMPACT.2015.7365226
  • Filename
    7365226