DocumentCode
3718338
Title
Microscopic deformation of polycrystalline pure copper wire during tension
Author
Naoya Tada;Yoshitaka Matsukawa;Takeshi Uemori;Toshiya Nakata
Author_Institution
Graduate School of Natural Science and Technology, Okayama University, 3-1-1 Tsushimanaka, Kita-ku, 700-8530, Japan
fYear
2015
Firstpage
229
Lastpage
232
Abstract
In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
Keywords
"Wires","Microscopy","Copper","Strain","Fatigue","Loading","Grain boundaries"
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN
978-1-4673-9690-5
Type
conf
DOI
10.1109/IMPACT.2015.7365226
Filename
7365226
Link To Document