Title :
Simulation studies on bipolar electrostatic chucks
Author :
Chih-Hung Li; Yi-Fan Chiu; Yi-Hsiuan Yu; Jian-Zhang Chen
Author_Institution :
Graduate Institute of Applied Mechanics, National Taiwan University, Taipei City 10617, Taiwan
Abstract :
We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated.
Keywords :
"Substrates","Clamps","Force","Electrostatics","Dielectric constant","Atmospheric modeling"
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
DOI :
10.1109/IMPACT.2015.7365233
