CIP metrology improving the bump yield in photo-lithography process

With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during four-month record and tracking. Through these effective and analytical efforts, the rework ratio in the abnormal PR coating contribution was decreased from 0.29% to 0.19%. The result for the auto misalignment was reduced from 0.23% to 0.13% as well for the repeatable defect from 0.17% to 0.1%. The whole package yield during these three issues was promoted around 0.3%.