Title :
A new reliable adhesion enhancement process for directly plating on molding compounds for package level EMI shielding
Author :
Kenichiroh Mukai;Tafadzwa Magaya;Brian Eastep;Kwonil Kim;Lee Gaherty;Anirudh Kashyap
Author_Institution :
Atotech USA Inc., 369 Inverness Parkway, #350, Englewood, CO, 80112, USA
Abstract :
Plating on molding compound is a relatively new field which could open up new package designs. One major application is conformal self EMI shielding (package level shielding) of ICs. Generally, EMI shielding is done mainly by metallic cans, however, this technique increases the space requirements and reduces flexibility of component layout on the PCB, that would not be suitable to handset products.
Keywords :
"Plating","Adhesives","Compounds","Metallization","Electromagnetic interference","Substrates"
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
DOI :
10.1109/IMPACT.2015.7365254