Title :
TID Impact on Process Modified CBRAM Cells
Author :
Y. Gonzalez-Velo;A. Mahmud;W. Chen;J. Taggart;H. J. Barnaby;M. N. Kozicki;M. Ailavajhala;K. E. Holbert;M. Mitkova
Author_Institution :
Sch. of Electr., Comput. &
Abstract :
In this study it is shown that Conductive Bridging Random Access Memory (CBRAM) might be sensitive to Total Ionizing Dose (TID) depending on the manufacturing process. TID levels at which sensitivity occurs for one of the studied processes are still very high, showing that CBRAM technology is a very interesting solution for future Non Volatile Memory (NVM) technologies to be used in space.
Keywords :
"Resistance","Switches","Yttrium","Metallization","Silver","Electrodes"
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2015 15th European Conference on
Print_ISBN :
978-1-5090-0232-0
DOI :
10.1109/RADECS.2015.7365685
