• DocumentCode
    3720826
  • Title

    Recent trends and considerations for high speed data in chips and system interconnects

  • Author

    Ignacio Llamas-Garro;Joan Bas;Josep M. F?brega;Michela Svaluto Moreolo;Benjamin Carrion Schafer;Reydezel Torres-Torres;M. R. T. de Oliveira;M. T. de Melo; Jung-Mu Kim;Dejan Vukobratovic

  • Author_Institution
    Centre Tecnol?gic de Telecomunicacions de Catalunya, (CTTC), Barcelona, Spain
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper discusses key issues related to the design of large processing volume chip architectures and high speed system interconnects. Design methodologies and techniques are discussed, where recent trends and considerations are highlighted.
  • Keywords
    "Integrated circuit interconnections","Hardware","Very large scale integration","Dielectrics","Metals","Computer architecture"
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Optoelectronics Conference (IMOC), 2015 SBMO/IEEE MTT-S International
  • Type

    conf

  • DOI
    10.1109/IMOC.2015.7369036
  • Filename
    7369036
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3720826