Title :
Recent trends and considerations for high speed data in chips and system interconnects
Author :
Ignacio Llamas-Garro;Joan Bas;Josep M. F?brega;Michela Svaluto Moreolo;Benjamin Carrion Schafer;Reydezel Torres-Torres;M. R. T. de Oliveira;M. T. de Melo; Jung-Mu Kim;Dejan Vukobratovic
Author_Institution :
Centre Tecnol?gic de Telecomunicacions de Catalunya, (CTTC), Barcelona, Spain
Abstract :
This paper discusses key issues related to the design of large processing volume chip architectures and high speed system interconnects. Design methodologies and techniques are discussed, where recent trends and considerations are highlighted.
Keywords :
"Integrated circuit interconnections","Hardware","Very large scale integration","Dielectrics","Metals","Computer architecture"
Conference_Titel :
Microwave and Optoelectronics Conference (IMOC), 2015 SBMO/IEEE MTT-S International
DOI :
10.1109/IMOC.2015.7369036
