Modal analysis of a metallic via hole by the WCIP

This paper presents a new electromagnetic modeling of a via-hole using a Wave Concept Iterative Procedure. There are specific TM modes associated with the insertion of the via-hole influencing the incident and reflected waves, called the “via´s modes”. The formulation and results are presented considering the influence of one and two via´s mode. The advantage of the model presented is the possibility to simulate planar circuits with a layer and a via-hole considering the effects of the field that propagates around the via.