• DocumentCode
    3721058
  • Title

    Realization of high speed switching of SiC power devices in voltage source converters

  • Author

    Zheyu Zhang;Fred Wang;Leon M. Tolbert;Benjamin J. Blalock;Daniel J. Costinett

  • Author_Institution
    Center for Ultra-wide-Area Resilient Electric Energy Transmission Networks (CURENT) Department of Electrical Engineering and Computer Science, The University of Tennessee, Knoxville, TN 37996-2250, USA
  • fYear
    2015
  • Firstpage
    28
  • Lastpage
    33
  • Abstract
    Four factors impact high speed switching of silicon carbide (SiC) devices in voltage source converters, including limited gate driving capability, cross-talk, parasitics associated in switching loop, and parasitics of inductive load. This paper focuses on a solution to mitigate the adverse impact of the aforementioned factors. First, an intelligent gate drive is developed for gate driving capability enhancement and cross-talk suppression. Second, placement and layout design of power devices, gate drive, and power stage board are proposed to minimize parasitics for fast switching and over-voltage mitigation. Third, an auxiliary filter is designed to mitigate the negative impact of inductive load´s parasitics during the switching transient. Finally, by utilizing all techniques developed above, a three-phase voltage source inverter with Cree 1200-V/20-A SiC MOSFETs is established. Test results show that the switching behavior of SiC devices in actual three-phase voltage source inverter fed motor drives can mostly repeat the switching performance tested by the optimally-designed double pulse test.
  • Keywords
    "Logic gates","Switches","Transient analysis","Silicon carbide","Inductance","Resistors","Impedance"
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2015 IEEE 3rd Workshop on
  • Type

    conf

  • DOI
    10.1109/WiPDA.2015.7369272
  • Filename
    7369272