DocumentCode :
3721707
Title :
Temperature robustness design for double-clamped MEMS sensors based on two orthogonal stress-immunity structure
Author :
Xinghua Wang;Dingbang Xiao;Zhanqiang Hou;Qingsong Li;Zhihua Chen;Xuezhong Wu
Author_Institution :
College of Mechatronics Engineering and Automation, Laboratory of Science and Technology on Integrated Logistics Support, National University of Defense Technology, Changsha, China
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
In micro-electro-mechanical system devices, the thermal stress and deformation caused by ambient temperature variation are of great concern since they can directly affect the performance of the devices. This paper presents an optimized temperature robustness design for double-clamped micro-structures. Robust operation over temperature is a critical criterion for most MEMS sensors, however different thermal mechanical properties of multi-layers structures will definitely cause internal stress and induce geometrical parameters deviated from the desired values which will result in frequency shift and affect the performance. Thus, an optimized strategy was proposed by integrating an orthogonal stress-immunity structure to control and eliminate these effects on double-clamped sensors. Furthermore, an optimized butterfly gyroscope was designed and fabricated to validate the improvement of this novel approach. Experimental results indicated that this novel strategy could effectively improve the temperature robustness of double-clamped micro-fabricated sensors. Also, the frequency split stability of the two vibration modes has been improved obviously (from 29.3Hz to 3.81Hz) while the drive mode frequency shift has decreased from 41.3Hz to 12.8Hz.
Keywords :
"Temperature sensors","Resonant frequency","Micromechanical devices","Gyroscopes","Stress","Temperature","Thermal stresses"
Publisher :
ieee
Conference_Titel :
SENSORS, 2015 IEEE
Type :
conf
DOI :
10.1109/ICSENS.2015.7370240
Filename :
7370240
Link To Document :
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