DocumentCode :
3721750
Title :
A low-power wireless bondwire inertial sensor system
Author :
Shih-Chieh Huang;Shao-Yung Lu;Fu-Yuan Cheng;Tsung-Heng Tsai;Yu-Te Liao
Author_Institution :
Department of Electrical Engineering, National Chung-Cheng University, Cliiayi, Taiwan
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 μm CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.
Keywords :
"Accelerometers","Acceleration","Inductance","Resonant frequency","Oscillators","Frequency conversion","Gold"
Publisher :
ieee
Conference_Titel :
SENSORS, 2015 IEEE
Type :
conf
DOI :
10.1109/ICSENS.2015.7370286
Filename :
7370286
Link To Document :
بازگشت