• DocumentCode
    3721750
  • Title

    A low-power wireless bondwire inertial sensor system

  • Author

    Shih-Chieh Huang;Shao-Yung Lu;Fu-Yuan Cheng;Tsung-Heng Tsai;Yu-Te Liao

  • Author_Institution
    Department of Electrical Engineering, National Chung-Cheng University, Cliiayi, Taiwan
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 μm CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.
  • Keywords
    "Accelerometers","Acceleration","Inductance","Resonant frequency","Oscillators","Frequency conversion","Gold"
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/ICSENS.2015.7370286
  • Filename
    7370286