• DocumentCode
    3726152
  • Title

    Heterogeneous three-dimensional assembly of metamaterials and metadevices by modular transfer printing

  • Author

    Seungwoo Lee;Byungsoo Kang;Hohyun Keum;Alaa Alokaily;Hyun-Sung Park;Numair Ahmed;John A. Rogers;Placid M. Ferreira;Seok Kim;Bumki Min

  • Author_Institution
    Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea
  • Volume
    2
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A metamaterial transfer printing method done by adhesion switching of viscoelastic stamp is presented. 3-D stack of heterogeneous material can be built at a desired position regardless of target substrate even on cheese.
  • Keywords
    "Metamaterials","Printing","Three-dimensional displays","Silicon","Surface treatment","Substrates","Adhesives"
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015 11th Conference on
  • Type

    conf

  • DOI
    10.1109/CLEOPR.2015.7376145
  • Filename
    7376145
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3726152