Title :
High-speed III-V devices for millimeter-wave receiver applications (Invited)
Author :
Tsuyoshi Takahashi;Masaru Sato;Kozo Makiyama;Yasuhiro Nakasha;Naoki Hara;Taisuke Iwai;Tsuyoshi Takahashi;Masaru Sato;Kozo Makiyama;Yasuhiro Nakasha;Naoki Hara
Author_Institution :
Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
Abstract :
We developed high-speed III-V devices for millimeter-wave receiver applications as InP-based high electron mobility transistors (HEMTs) that had a cavity structure and zero-bias GaAsSb-based heterojunction backward diodes. A high cutoff frequency (fT) of 517 GHz and minimum noise figure (NFmin) of 0.71 dB at 94 GHz were achieved for the InP-based HEMTs, even after the passivation process, by adopting the cavity structure. Since GaAsSb-based diodes that are based on p+-GaAsSb/i-InAlAs/n-InGaAs are mostly lattice-matched to InP, they can be easily integrated with InP-based low-noise amplifiers (LNAs). They indicated a sensitivity of 20,400 V/W at 94 GHz. By integrating the backward diodes with LNAs, highly sensitive receiver MMICs can be fabricated.
Keywords :
"Cavity resonators","HEMTs","Schottky diodes","MODFETs","Logic gates","Receivers","MMICs"
Conference_Titel :
Radio-Frequency Integration Technology (RFIT), 2015 IEEE International Symposium on
DOI :
10.1109/RFIT.2015.7377946