The analysis on thermal fatigue life of LCCC package based on strain fatigue model and FEM

In this paper, we take the typical LCCC electronic package structure as the research object, which is under the load of temperature cycle, and evaluate the thermal fatigue life of its solder joint based on the strain fatigue model and finite element method (FEM), and then predict its thermal fatigue life by using the engineering algorithm of electronic package structure. The results show that the life based on finite element simulation method and the life base on engineering algorithm are consistent to a certain extent and the way using strain fatigue model and finite element method to solve the thermal fatigue life of LCCC electronic package structure is worthy to expand.