Electrothermal characteristics of carbon-based through-silicon via (TSV) channel

In this paper, a carbon-based through-silicon via (TSV) channel, which is composed of vertical carbon nanotube (CNT) TSV and horizontal multilayer graphene (MLG) global wire, is proposed and examined by using an electrothermal co-simulation program. This program is in-house developed based on finite element method (FEM). In particular, both anisotropies and temperature dependences of material parameters, i.e. electrical and thermal conductivities of carbon nanomaterials involved have been treated in an appropriate way. The temperature profile of carbon-based TSV channel is plotted and compared with that of Cu counterpart. It is shown that the carbon-based TSV channel show better heat handling capability although it has slight large voltage drop.