DocumentCode :
3731679
Title :
Wideband equivalent circuit model for a through silicon via with effective substrate current loop
Author :
Kibeom Kim;Karam Hwang;Seungyoung Ahn
Author_Institution :
GSGT, KAIST, Deajeon, South Korea
fYear :
2015
Firstpage :
12
Lastpage :
14
Abstract :
An equivalent circuit model of through silicon via considering the eddy current flow inside the silicon is proposed to predict the electrical performance up to 100GHz. The parasitic elements of the proposed circuit model are derived by the structural dimensions and material properties of the TSV, and its electrical performance of the proposed equivalent circuit model is analyzed with structure size variations. The analyzed results show the proposed model accurately expresses the physical meaning.
Keywords :
"Integrated circuit modeling","Silicon","Substrates","Equivalent circuits","Inductance","Wires","Packaging"
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
Type :
conf
DOI :
10.1109/EDAPS.2015.7383663
Filename :
7383663
Link To Document :
بازگشت