TSV fault detection with large non-contact probes using capacitive coupling for 3-D IC applications

A non-contact TSV fault detection method is proposed using capacitive coupled probing. The proposed method detects TSV faults by eye-pattern diagrams of extracted EM-modeled transfer characteristics. The TSV and a capacitive coupling is modeled using full wave analysis. Because the measurement is conducted by moving one top probe without contact alignment, it can achieve the fast detection. Moreover, several TSVs can be covered at one measurement. From the experimental results, the fault existence and no. of faults can be detected with good resolutions.