• DocumentCode
    3731687
  • Title

    Characterization and simulation for 2.5-D interposer

  • Author

    Chung-Long Pan;Yu-Jung Huang;Chun-Yi Wang

  • Author_Institution
    Department of Electrical Engineering, I-Shou University, Kaohsiung 84008, Taiwan
  • fYear
    2015
  • Firstpage
    74
  • Lastpage
    77
  • Abstract
    Characterization of interposer in a 2.5-D stacked IC is essential for yield learning and design optimization. To examine the effect of design parameters of the interposer structure on different substrate materials, the S11 and S21 curves for various substrate materials are obtained from the full-wave simulation. With the simulation results, it is observed that polyimide and glass interposer shows better electrical performance compared to silicon interposer.
  • Keywords
    "Substrates","Silicon","Through-silicon vias","Three-dimensional displays","Glass","Packaging","Conductivity"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/EDAPS.2015.7383671
  • Filename
    7383671
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3731687