Title :
Power integrity co-analysis and design in a PCB with BGA package using transmission matrix method
Author :
Xiao-Jian Ma;Xiao-Chun Li;Ning Wang;Jun-Fa Mao
Author_Institution :
Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China
Abstract :
Power integrity (PI) is among the main concerns in the design process of multilayer packages and printed circuit boards (PCBs). Based on Transmission Matrix Method (TMM), the PI performance of a Ball grid array (BGA) package mounted on a PCB is investigated in this paper. The power/ground planes and the power/ground balls on a PCB and package are entirely equivalent to distributed RLGC circuits model and co-analyzed. From this model, power performance could be computed with high efficiency. Moreover, a design rule of power/ground balls arrangement is obtained by reducing the equivalent inductance and equivalent capacitance of BGA for good power integrity performance.
Keywords :
"Integrated circuit modeling","Computational modeling","Inductance","Mathematical model","Capacitance","Analytical models","Transmission line matrix methods"
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
DOI :
10.1109/EDAPS.2015.7383672
