DocumentCode
3731688
Title
Power integrity co-analysis and design in a PCB with BGA package using transmission matrix method
Author
Xiao-Jian Ma;Xiao-Chun Li;Ning Wang;Jun-Fa Mao
Author_Institution
Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China
fYear
2015
Firstpage
78
Lastpage
80
Abstract
Power integrity (PI) is among the main concerns in the design process of multilayer packages and printed circuit boards (PCBs). Based on Transmission Matrix Method (TMM), the PI performance of a Ball grid array (BGA) package mounted on a PCB is investigated in this paper. The power/ground planes and the power/ground balls on a PCB and package are entirely equivalent to distributed RLGC circuits model and co-analyzed. From this model, power performance could be computed with high efficiency. Moreover, a design rule of power/ground balls arrangement is obtained by reducing the equivalent inductance and equivalent capacitance of BGA for good power integrity performance.
Keywords
"Integrated circuit modeling","Computational modeling","Inductance","Mathematical model","Capacitance","Analytical models","Transmission line matrix methods"
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
Type
conf
DOI
10.1109/EDAPS.2015.7383672
Filename
7383672
Link To Document