• DocumentCode
    3731690
  • Title

    Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer

  • Author

    Insu Hwang;Jihye Kim;Youngwoo Kim;Jonghyun Cho;Joungho Kim;Venky Sundaram;Rao Tummala

  • Author_Institution
    Terahertz Interconnection and Package Laboratory, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea
  • fYear
    2015
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    Through glass via(TGV)-TGV coupling noise could badly affect to glass interposer based 2.5D/3D ICs RF system. RF system specification is specified with RF sensitivity. And RF sensitivity is dominantly determined by LNA noise figure. Normally LNA noise figure is calculated with only device and thermal noise since it assumes no noise coupling is exist. For estimating LNA noise figure degradation by TGV-TGV coupling noise, we proposed modified LNA noise figure equation which includes coupling noise effect. For analysis, we designed 2.4GHz LNA schematic and proposed TGV-TGV coupling structure which includes TGVs and channel lines. And then we analyzed output waveform of the LNA with TGV-TGV noise coupling on time domain and frequency domain when single tone noise is injected to LNA components. Finally we estimated noise figure degradation by single tone switching noise.
  • Keywords
    "Couplings","Noise figure","Radio frequency","Mathematical model","Glass","Sensitivity","Degradation"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/EDAPS.2015.7383674
  • Filename
    7383674