Crosstalk analysis and suppression for differential TSVs in 3-D integration

Differential through silicon vias (TSVs) are commonly used for the differential signaling in three-dimensional (3-D) integration, which may be disturbed by the electromagnetic field of the neighboring signal/ground paths. In this paper, the equivalent circuit model of the differential TSVs is established. Then the induced noise on the differential TSVs from the neighboring single-ended and differential TSVs are evaluated, in terms of the interference distance and the coupling strength inside the differential TSVs. To mitigate the noise interference, a twisted differential TSVs structure and an offset twisted differential TSVs arrangement are proposed. Results show that the noise magnitude can be effectively reduced by the proposed structures in the frequency domain and time domain.