Title :
A novel packaging method of fully passive optical alignment for multi-chennel optical interconnection module
Author :
Kwon-Seob Lim;Hyun Seo Kang;Jae-Hyung Jang
Author_Institution :
Communications and Internet Research Laboratory, Electronics and Telecommunications Research Institute, Gwangju, South Korea
Abstract :
In this paper, a novel packaging method of fully passive optical alignment and surface mounting for parallel optical interconnects modules has been developed for a high-capacity data transmission such as chip-to-chip and board-to-board interconnects within smart device and interconnects between devices.
Keywords :
"Optical interconnections","Optical transmitters","Optical coupling","Optical fibers","Optical receivers","Optical device fabrication"
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
DOI :
10.1109/EDAPS.2015.7383690
