• DocumentCode
    3731706
  • Title

    A novel packaging method of fully passive optical alignment for multi-chennel optical interconnection module

  • Author

    Kwon-Seob Lim;Hyun Seo Kang;Jae-Hyung Jang

  • Author_Institution
    Communications and Internet Research Laboratory, Electronics and Telecommunications Research Institute, Gwangju, South Korea
  • fYear
    2015
  • Firstpage
    156
  • Lastpage
    158
  • Abstract
    In this paper, a novel packaging method of fully passive optical alignment and surface mounting for parallel optical interconnects modules has been developed for a high-capacity data transmission such as chip-to-chip and board-to-board interconnects within smart device and interconnects between devices.
  • Keywords
    "Optical interconnections","Optical transmitters","Optical coupling","Optical fibers","Optical receivers","Optical device fabrication"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/EDAPS.2015.7383690
  • Filename
    7383690
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3731706