Title :
Design of stackup and shorting vias and for reducing edge radiation in multilayer PCB
Author :
Kai-Bin Wu;Cheng-Yu Lin;Shih-Ya Huang;Ruey-Beei Wu
Author_Institution :
Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei 10617, Taiwan
Abstract :
A practical multilayer printed-circuit-board (PCB) with current excitations is be decomposed into even-mode and odd-mode. The radiation of even-mode exhibits the lower bound of edge radiation and dominates the radiation of system as shorting vias are dense enough. Based on the mode decomposition, the guidelines of stackup for EMI consideration is proposed under practical IO current drawing. After the stackup analysis, some examples with/without shorting via will show the benefit of proposed suggestions. Also, the simulation and design examples will validate the design idea of this paper.
Keywords :
"Nonhomogeneous media","Electromagnetic interference","Electric fields","Capacitors","Substrates","Guidelines","Periodic structures"
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
DOI :
10.1109/EDAPS.2015.7383709