A new reliability assessment model for power electronic modules

The reliability of power electronic modules is investigated in a series system configuration. The impact of the increased junction temperature, caused by initiation of degradation process, is studied and captured to assess the effect on other component degradation processes: wire bond lift-off and the chip solder joint delamination. The proposed reliability model combines physics of failure modeling and probabilistic modeling to demonstrate the degradation processes affecting power electronic module lifetime. The effectiveness of the proposed model is further demonstrated by a numerical example.