Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study

In order to continue survive in today´s competitive business environment, the key to success for many manufacturing companies is productivity. In response to the external pressure of global competition, many firms were compelled to implement and focus on productivity improvement. Numerous quality management approaches and tools such as Toyota Production System (TPS), Total Productive Maintenance (TPM), Failure Mode and Effect Analysis (FMEA) and Lean Manufacturing had been developed in order to achieve operational excellent. TPM is a world-class manufacturing strategy which helps manufacturers to reduce production waste. Overall Equipment Effectiveness (OEE) provides a quantitative metric to measure effectiveness of TPM implementation. This paper presents the implementation of maintenance-FMEA to improve OEE in a semiconductor manufacturing firm. The FMEA was conducted by using five steps approach on a bottleneck process. Results from the FMEA provide a list of prioritized corrective actions which the plant manager can implement to improve equipment OEE.