DocumentCode :
3733978
Title :
How future mobility meets IT: Cyber-physical system designs revisit semiconductor technology
Author :
Hideto Hidaka
Author_Institution :
Renesas Electronics Corporation, Japan
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
Cyber-Physical System (CPS) exemplified by future mobility application systems necessitates unconventional embedded design considerations in embedded systems; multiples latency-aware computing and communication construction, the importance of once non-functional requirements like security and safety to cover physical- and cyber-systems, and VLSI life-time design by ecology. All in all we have to reexamine and re-organize current semiconductor technology to produce platform bases for connected open collaborations to tackle global human challenges.
Keywords :
"Very large scale integration","Safety","Sensors","Automotive engineering","Security","System analysis and design","Cyber-physical systems"
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2015 IEEE Asian
Type :
conf
DOI :
10.1109/ASSCC.2015.7387514
Filename :
7387514
Link To Document :
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