DocumentCode :
3735665
Title :
Temperature stabilized chip expander
Author :
Michal ?ezn??ek;Martin Bur??k;Jaroslav Jankovsk?;V?clav ?imek;Richard R??i?ka
Author_Institution :
Brno university of Technology, Brno, Czech Republic
fYear :
2015
Firstpage :
1
Lastpage :
6
Abstract :
The need for reliable measurements and testing of experimental semiconductor structures gives a rise to imminent problem with the connection between the chip and the measuring instrumentation. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to the experimental silicon chip. It also allows an easy fan-out of chip terminals into a larger area. Very flat planar configuration of the chip expander make it possible to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip comprises also the possibility of its own temperature stabilization through the heating element located on the reverse side. Due to its features including CTE and optional flexible leads (gull-wing), this chip expander can be also used as an adapter for easy integration of large semiconductor dies into ordinary test boards (FR4). This article is dealing with an application of chip expander in the context of experimental polymorphic circuits. In this case chip expander with attached polymorphic chip REPOMO32 is thermally stabilized at a temperature range from ambient temperature up to approximately 120 ° C. In fact, polymorphic circuits can be considered as a specific example of multifunctional circuits where the change of the operation mode comes from the intrinsic adaptation of operational characteristics of the components involved in the circuit in response to the surrounding temperature.
Keywords :
"Temperature","Logic gates","Finite impulse response filters","Europe","Substrates","Heating"
Publisher :
ieee
Conference_Titel :
Microelectronics Packaging Conference (EMPC), 2015 European
Type :
conf
Filename :
7390688
Link To Document :
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