Title :
Thin Film based lcp multi-layer circuits: Manufacturing technology and characterization
Author :
Alexander Kaiser;Carlos Maximilian Bee;Frederic Dupuis;Rene von Metzen;Karin Rue?;Paul Matej;Christian Herbort;Bruno Holl;Sebastian L?ffler;G?nther Baub?ck;Karl-Heinz Fritz
Author_Institution :
Cicor Advanced Microelectronics and Substrates, Ulm, Germany
Abstract :
In contrary to multi-layer circuits traditionally manufactured in standard PCB (Printed Circuit Board) technology, this article specifically describes a technology which combines the benefits of Thin Film Technology processes with methods from the PCB technology. Noble metals for the formation of conductor lines combined with laminated LCP (Liquid Crystal Polymer) polymers as substrate and insulator materials allow the formation of multi-layer circuits with only a very limited number of different participating materials. Such types of circuits can be made completely out of biocompatible materials and thus, are excellently suitable for applications inside the human body. This article will describe the general aspects of this technology and discuss the process flow for the manufacturing of thin film based LCP multi-layer circuits. Characterization results from stability examinations of these circuits in buffered saline solution are shown and discussed to prove the performance of the manufactured circuit structures.
Keywords :
"Lamination","Laminates","Manufacturing","Microelectronics","Gold","Process control"
Conference_Titel :
Microelectronics Packaging Conference (EMPC), 2015 European