Assembly of transducer array using anisotropic conductive film for medical imaging applications

Interconnection technology based on anisotropic conductive film (ACF) has been selected to assemble a transducer array on a flexible substrate in ultrasound imaging applications. The process of bonding and subsequently dicing a transducer on a flexible substrate was evaluated. The results show good integrity of ACF interconnects in test samples undergoing the assembly process. The interconnects, composed of a transducer element and a flex pad, retain high mechanical shear strength and low electrical resistance even after the tough dicing process. Furthermore, a high process yield promising for implementation in industry has been obtained. This work has demonstrated the feasibility of using ACF for assembling ultrasound transducers on system substrates.