Functionalized sensor packaging based on thermoset injection molding and selective metallization technology

The material properties of thermosets offer a versatile alternative to thermoplastic materials from state of the art MID technology. Chemical resistance, thermal conductivity, thermal expansion behavior and mechanical strength can be adapted to the applications need. Compared to transfer molding, thermoset injection molding uses cheaper materials and provides more efficient processing parameters, leading to significant advantages as encapsulation method for electronic devices. For functionalizing the encapsulated assembly, a new laser based patterning process was developed. The material surface was roughened by the laser beam. Using a pretreatment process employing a palladium based activator and a subsequent rinsing process, a seeding layer was selectively deposited within the laser roughened structures. The laser patterned tracks were metalized selectively by electroless plating using various metal layers. Using the same process, vias were laser drilled into the packaging. Thereby, interconnects and multilayer systems could be realized by the new process.