Heat sensitive joining method for miniaturized sensor components in medical technology

Innovative medical products generate new challenges for the electronics packaging. The solder joining on heat-sensitive and copper-cladded polymer substrate is the urgent activity. In this paper preliminary studies will be presented for the ignition behavior of a reactive multilayer foil, in order to ensure the formation of a solder joint. Here, a ignition mechanism is selected and evaluated. The solder joining using a reactive multilayer foil and a solder paste is performed on an evaluation board. In this case SMD resistors are joined on the board and then subjected to a shear test. The shear forces of the SMD resistors joined by reactive multilayer foil are compared with a control group of classically joined SMD resistors (dispensing of solder paste and soldered with a continuous oven). Finally, based on the results suggestions for improvement will be discussed.