Title :
Reconfigurable Computing, 3D Integration, and Recognizing Leaders in our Field
Author_Institution :
Thomas J. Watson Research Center
Abstract :
This column discusses the special issue on reconfigurable computing, Micro´s current calls for papers, topics from the recent business meeting, and recent computer architecture award winners.
Keywords :
3D silicon integration; B. Ramakrishna Rau award; FPGA; ISCA most influential paper award; Maurice Wilkes award; TSVs; big data; harsh systems; high-speed data center interconnects; mobile systems; reconfigurable computing;
Journal_Title :
Micro, IEEE
