DocumentCode
3740916
Title
Block-based SRAM architecture and thermal-aware memory mappings for three-dimensional channel decoding systems
Author
Shu-Yen Lin;Cheng-Hung Lin;Ho-Yun Su
Author_Institution
Department of Electrical Engineering, Yuan Ze University, Jungli, Taiwan, 32003, R.O.C.
fYear
2015
Firstpage
277
Lastpage
278
Abstract
In this work, the 3D block-based SRAM architecture and the thermal-aware memory mappings are proposed for the 3D channel decoding systems. The 3D block-based SRAM is proposed by analyzing the memory utilization with different sizes of the memory elements. Based on this architecture, the thermal-aware memory mappings are discussed by minimizing the vertical stacking of the active MEs and avoiding the successive access of the MEs. In our experiments, the peak temperature can be reduced by 2.6°C ~ 22.2°C compared to the worst mappings.
Keywords
"Decoding","Random access memory","Three-dimensional displays","Kernel","Parity check codes","Stacking","Memory architecture"
Publisher
ieee
Conference_Titel
Consumer Electronics (GCCE), 2015 IEEE 4th Global Conference on
Type
conf
DOI
10.1109/GCCE.2015.7398610
Filename
7398610
Link To Document