• DocumentCode
    3740916
  • Title

    Block-based SRAM architecture and thermal-aware memory mappings for three-dimensional channel decoding systems

  • Author

    Shu-Yen Lin;Cheng-Hung Lin;Ho-Yun Su

  • Author_Institution
    Department of Electrical Engineering, Yuan Ze University, Jungli, Taiwan, 32003, R.O.C.
  • fYear
    2015
  • Firstpage
    277
  • Lastpage
    278
  • Abstract
    In this work, the 3D block-based SRAM architecture and the thermal-aware memory mappings are proposed for the 3D channel decoding systems. The 3D block-based SRAM is proposed by analyzing the memory utilization with different sizes of the memory elements. Based on this architecture, the thermal-aware memory mappings are discussed by minimizing the vertical stacking of the active MEs and avoiding the successive access of the MEs. In our experiments, the peak temperature can be reduced by 2.6°C ~ 22.2°C compared to the worst mappings.
  • Keywords
    "Decoding","Random access memory","Three-dimensional displays","Kernel","Parity check codes","Stacking","Memory architecture"
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics (GCCE), 2015 IEEE 4th Global Conference on
  • Type

    conf

  • DOI
    10.1109/GCCE.2015.7398610
  • Filename
    7398610