Title :
A sorting-based micro-bump assignment for 3D ICs
Author :
Ran Zhang;Tieyuan Pan;Takahiro Watanabe
Author_Institution :
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu, Japan
Abstract :
Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
Keywords :
"Wires","Routing","Three-dimensional displays","Integrated circuits","Sorting","Yttrium"
Conference_Titel :
SoC Design Conference (ISOCC), 2015 International
DOI :
10.1109/ISOCC.2015.7401697
