• DocumentCode
    3742628
  • Title

    A sorting-based micro-bump assignment for 3D ICs

  • Author

    Ran Zhang;Tieyuan Pan;Takahiro Watanabe

  • Author_Institution
    Graduate School of Information, Production and Systems, Waseda University, Kitakyushu, Japan
  • fYear
    2015
  • Firstpage
    139
  • Lastpage
    140
  • Abstract
    Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
  • Keywords
    "Wires","Routing","Three-dimensional displays","Integrated circuits","Sorting","Yttrium"
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2015 International
  • Type

    conf

  • DOI
    10.1109/ISOCC.2015.7401697
  • Filename
    7401697
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3742628