DocumentCode :
3746146
Title :
A novel thermal-aware structure of TSV cluster
Author :
Jingyan Fu;Ligang Hou;Jinhui Wang;Bo Lu;Wei Zhao;Yang Yang
Author_Institution :
Beijing University of Technology, Beijing, China
fYear :
2015
Firstpage :
406
Lastpage :
409
Abstract :
Although thermal-aware TSV (Through Silicon Via) cluster´s behavior has been studied extensively, the structure of TSV cluster, which is also important to thermal problem in 3D IC (Three Dimensional Integrate Circuit), is ignored. In this paper, a novel structure of TSV cluster is proposed to improve the thermal performance of 3D IC. Models have been established to study the effect of TSV cluster´s structure on thermal performance in 3D IC. Simulation results show that the proposed TSV cluster´s structure improves the thermal performance of 3D IC, which can help to alleviate the thermal problem.
Keywords :
"Heating","Three-dimensional displays","Integrated circuit modeling","Through-silicon vias","Thermal conductivity","Silicon"
Publisher :
ieee
Conference_Titel :
System-on-Chip Conference (SOCC), 2015 28th IEEE International
Electronic_ISBN :
2164-1706
Type :
conf
DOI :
10.1109/SOCC.2015.7406993
Filename :
7406993
Link To Document :
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