Fabrication-Efficient Flip-Chip-Bondable 850-nm VCSELs With an X-Shaped Vertical Cavity

Author

Roscher, H. ; Michalzik, Rainer

Author_Institution

Inst. of Optoelectron., Ulm Univ., Ulm, Germany

Volume

19

Issue

4

fYear

2013

fDate

July-Aug. 2013

Firstpage

1700810

Lastpage

1700810

Abstract

We present a novel approach to flip-chip-bondable vertical-cavity surface-emitting lasers and 2-D arrays emitting at 850 nm, the standard for multimode fiber optical interconnects. A unique sequence of wet-etching steps renders laser fabrication particularly efficient and allows the incorporation of near-cavity heat spreaders. Record-low thermal resistances of substrate-removed devices are achieved without compromising the dynamic properties.

Keywords

flip-chip devices; optical fabrication; optical interconnections; surface emitting lasers; 2D arrays; X-shaped vertical cavity; dynamic properties; flip-chip-bondable VCSEL; laser fabrication; multimode fiber optical interconnects; near-cavity heat spreaders; substrate-removed devices; vertical-cavity surface-emitting lasers; wavelength 850 nm; wet-etching; Etching; Heating; Metals; Mirrors; Substrates; Vertical cavity surface emitting lasers; 2-D array; Data transmission; fabrication technology; flip-chip bonding; optical interconnect; semiconductor laser; space-division multiplexing; thermal resistance; vertical-cavity surface-emitting laser (VCSEL);

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2013.2244571

Filename

6425401