• DocumentCode
    3748163
  • Title

    Application-oriented performance of RF CMOS technologies on flexible substrates

  • Author

    Justine Philippe;A. Lecavelier;M. Berthome;J.-F. Robillard;C. Gaquiere;F. Danneville;D. Gloria;C. Raynaud;E. Dubois

  • Author_Institution
    Institut d´Electronique de Microelectronique et de Nanotechnologie - IEMN UMR8520, Avenue Poincare, F-59652 Villeneuve d´Ascq
  • fYear
    2015
  • Abstract
    Ultimate-thinning-and-transfer-bonding (UTTB) of RF SOI-CMOS chips is demonstrated on plastic, metal and glass substrates. Beyond process simplicity, UTTB can be tailored to meet specific application requirements like ultra mechanical flexibility, heat dissipation, transparency while retaining same fT/fmax performance and improving harmonic rejection when compared to conventional rigid SOI.
  • Keywords
    "Substrates","Radio frequency","Glass","CMOS integrated circuits","Logic gates","MOSFET circuits","Silicon"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2015 IEEE International
  • Electronic_ISBN
    2156-017X
  • Type

    conf

  • DOI
    10.1109/IEDM.2015.7409707
  • Filename
    7409707
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3748163