• DocumentCode
    3748217
  • Title

    High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology

  • Author

    Chung-Hao Tsai;Jeng-Shien Hsieh;Wei-Heng Lin;Liang-Ju Yen;Jeng-Nan Hung;Tai-Hao Peng;Hsi-Ching Wang;Cheng-Yu Kuo;Issac Huang;Welling Chu;Yi-Yang Lei;C. H. Yu;Lawrence C. Sheu;Ching-Hua Hsieh;C. S. Liu;Kuo-Chung Yee;Chuei-Tang Wang;Doug Yu

  • Author_Institution
    R&D, TSMC, Ltd. 168, Park Ave. 2, Hsinchu Science Park, Hsinchu County, Taiwan 308-44, R.O.C.
  • fYear
    2015
  • Abstract
    High performance passive devices for millimeter wave (MMW) system, including inductor, ring resonator, power combiner, coupler, balun, transmission line, and antenna, are first realized using integrated fan-out (InFO) wafer level packaging technology. The inductors has quality factor over 40; the power combiner, coupler, and balun show lower transmission loss than on-chip passives; antenna has the efficiency of over 60%. These devices on InFO enable low noise and power MMW system for mobile communication and IoT applications.
  • Keywords
    "Loss measurement","Transmission line measurements","Propagation losses","Inductors","Couplers","Impedance matching","Power combiners"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2015 IEEE International
  • Electronic_ISBN
    2156-017X
  • Type

    conf

  • DOI
    10.1109/IEDM.2015.7409763
  • Filename
    7409763
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3748217