DocumentCode :
3748223
Title :
Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications
Author :
Yu Lu;Tom Zhong;W. Hsu;S. Kim;X. Lu;J. J. Kan;C. Park;W. C. Chen;X. Li;X. Zhu;P. Wang;M. Gottwald;J. Fatehi;L. Seward;J. P. Kim;N. Yu;G. Jan;J. Haq;S. Le;Y. J. Wang;L. Thomas;J. Zhu;H. Liu;Y. J. Lee;R. Y. Tong;K. Pi;D. Shen;R. He;Z. Teng;V. Lam;R. Annapra
Author_Institution :
Qualcomm Technologies, Inc., San Diego, CA 92121
fYear :
2015
Abstract :
We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.
Keywords :
"Nonvolatile memory","Redundancy","Tunneling magnetoresistance","Maintenance engineering","Switches","Resistance","Metals"
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
Type :
conf
DOI :
10.1109/IEDM.2015.7409770
Filename :
7409770
Link To Document :
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