Title :
Thermal and electrical behaviour of stress relieving coatings
Author :
R.I. Frame;D.J. Tedford
Author_Institution :
Department of Electronic and Electrical Engineering, University of Strathclyde, Glasgow, G1 1XW, U.K.
fDate :
7/1/1983 12:00:00 AM
Abstract :
(1) An evaluation of the material used for stress relief has been undertaken using TGA and isothermal methods which has shown the alkyd resin based sample to be more resilient to long-term thermal ageing.
Keywords :
"Thermal engineering","Coatings","Thermal analysis","Shape","Aging"
Conference_Titel :
Conduction and Breakdown in Solid Dielectrics, Proceedings of First International Conference on
DOI :
10.1109/ICSD.1983.7411500
