DocumentCode :
3749632
Title :
Reliability analysis experiment of electro migration and maximum current test
Author :
Chi-Yang Li;Kuan-I Cheng;Sung-Mao Wu;Tung-Bao Lu;Yi-Chang Lee
Author_Institution :
Micro Electronic Packaging Laboratory, Department of Electrical Engineering, National University of Kaohsiung, Taiwan
Volume :
1
fYear :
2015
Firstpage :
1
Lastpage :
3
Abstract :
In this paper, the main purpose is reliability analysis. To find what kinds of environment will impact the inner structure of sample. Two of the objective is emerged from this study. First, electro-migration in sample under high current density has become a critical reliability issue. Carry current density test is to probe the failure phenomenon of electro-migration on inner structure. Then compare the experiment result to analyze current withstand. Secondly, maximum current test with large current passing by the sample instantly to finds the maximum current, and observe the effect of Copper pillar. Finally, by integrating the result to know the information of the sample on operating restrictions, and improve the sample from experiment data.
Keywords :
"Reliability","Current density","Decision support systems","Probes","Copper"
Publisher :
ieee
Conference_Titel :
Microwave Conference (APMC), 2015 Asia-Pacific
Print_ISBN :
978-1-4799-8765-8
Type :
conf
DOI :
10.1109/APMC.2015.7411701
Filename :
7411701
Link To Document :
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